MICROELECTRONIC SYSTEMS NEWS

FILENUMBER: 1035 BEGIN_KEYWORDS INTERNATIONAL TECHNOLOGY ROADMAP SEMICONDUCTORS END_KEYWORDS DATE: November 2001 TITLE: INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS
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TITLE: INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS

The International Technology Roadmap for Semiconductors (ITRS) is
an  assessment  of the semiconductor technology requirements. The
objective of the ITRS is to ensure advancement in the performance
of integrated circuits. This assessment, called roadmapping, is a
cooperative effort  of  the  global  industry  manufacturers  and
suppliers, government organizations, consortia, and universities.
The ITRS identifies the technological challenges and needs facing
the  semiconductor  industry  over  the  next  15  years.  It  is
sponsored by the Semiconductor Industry  Association  (SIA),  the
European  Electronic  Component  Association  (EECA),  the  Japan
Electronics  &  Information  Technology  Industries   Association
(JEITA),  the  Korean  Semiconductor Industry Association (KSIA),
and Taiwan Semiconductor Industry Association (TSIA) .

The ITRS process encourages discussion and debate throughout  the
community  about  the requirements for success. The key factor in
the success of this Roadmap is obtaining  consensus  on  industry
drivers,  requirements, and technology timelines.  The Technology
Working  Groups  (TWG)  are  the  organizations  that  build  the
roadmaps.  These  representatives  assess the state of technology
and identify areas that may provide solutions.  The  TWG  members
also  indicate  opportunities  for  new  research and innovation.
These groups are made up of  volunteer  technology  experts  from
chip manufactures, supplier companies, universities and academia,
technology labs,  and  semiconductor  technology  consortia.  The
Technology  Working  Groups, also known as TWGs, are comprised of
the technical disciplines of  Design  Test  Process  Integration,
Devices,   and   Structures   Front   End  Processes  Lithography
Interconnect   Factory   Integration   Assembly   and   Packaging
Environment,  Safety,  and  Health Defect Reduction Metrology and
Modeling and Simulation.

For additional information, including the  2001  edition  to  the
Roadmap, access: ROADMAP

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