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TITLE: MEMS EXCHANGE NETWORK
MEMS Exchange is a network of fabrication and design centers that
has been organized and connected so that a user can draft a
process sequence that accesses multiple facilities. Planning,
logistics, and billing, as well as detailed network operation and
management are handled by the MEMS Exchange staff, who act as a
"trusted intermediary" between the fabrication service providers
and the user community. The fabrication service providers
consists of academic labs, commercial fabrication facilities, and
government labs including: Analog Devices, Case Western Reserve
University, Cornell Nanofabrication Facility, Louisiana State
University, Microwave Bonding Instruments, Sony Semiconductor,
Stanford Nanofabrication Facility, Teledyne Electronic
Technologies, UC Berkeley and the University of Michigan.
The nodes of the network are interconnected via the World Wide
Web and package courier services (e.g., Federal Express). The
nodes offer services in the form of fabrication processes and
sequences. Fabrication service offerings consist of individual
discrete processing steps, whole or partial MEMS device process
sequences, and commercial integrated circuit fabrication
processes. The fabrication can be completely performed at a
single facility in specialized cases where a single facility
offers all the needed processing steps; but in the more likely
case where the required processing capabilities are scattered
across different locations, it will be performed at several
fabrication locations. The MEMS Exchange administers the services
of the nodes and collects fees for the services executed and
returns them to the respective nodes.
For additional information, access: MEMS EXCHANGE
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