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TITLE: LASER RESTRUCTURING FOR PROGRAMMABLE ARRAYS USING MAKELINK
Laser restructuring is now cost-effective for programming analog
and digital gate array devices using MAKELINK.
The new technique provides a low capacitance, low resistance,
ohmic, high reliability, high yield, high density alternative to
laser fuses. MAKELINK is implemented without any extra
processing steps and is directly compatible with standard multi-
level interconnect. Furthermore, the reliability of the laser
formed links has been proven to exceed Mil-Hdbk 885-E reliability
specification for CLASS B, ground-based operation. These links
are as good as the metalization being linked. The approach also
works on new metalization systems such as copper. MAKELINK is
expected to surpass cutting in all applications where post-
process programming is required. The specifications of the
linking technology make it highly suitiable for ANALOG and
MIXED-SIGNAL, SoC, and all low-cost technologies made
with standard metallization.
For additional information, access: MAKELINK
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FILENUMBER: 1062
BEGIN_KEYWORDS
LASER RESTRUCTURING MAKELINK
END_KEYWORDS
DATE: July 2002
TITLE: LASER RESTRUCTURING FOR PROGRAMMABLE ARRAYS USING MAKELINK
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