MICROELECTRONIC SYSTEMS NEWS

FILENUMBER: 1145 BEGIN_KEYWORDS Resolution Enhancement Optical Lithography OPC END_KEYWORDS DATE: November 2003 TITLE: Resolution Enhancement for Optical Lithography
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TITLE: Resolution Enhancement for Optical Lithography

Optical lithography distortions that occur in the manufacture  of
integrated  circuits  are being addressed by multiple techniques.
Since the early 1970's, optical proximity  correction  or OPC has
been  used  to  produce smaller features in an IC  using  a given
equipment  set. OPC  applies  systematic  changes  to   photomask
geometries  to    compensate  for  nonlinear  distortions  caused
by   optical  diffraction    and    resist    process    effects.
Specifically,  these distortions  include  line-width  variations
dependent on pattern density which affect  a  device's  speed  of
operation    and    line-end   shortening    which    can   break
connections   to   contacts.   Causes  include  reticle   pattern
fidelity,  optical proximity effects,  and diffusion  and loading
effects   during   resist   and   etch   processing.    A    mask
incorporating    OPC    is   thus   a   system    that    negates
undesirable distortion effects during pattern transfer.

OPC  works  by  making  small  changes  to  the  IC  layout  that
anticipate   the   distortions.   To   compensate   for  line-end
shortening, the line is extended using a  hammerhead  shape  that
results  in  a  line  in  the  resist  that is much closer to the
original intended layout.  To  compensate  for  corner  rounding,
serif shapes are added to (or subtracted from) corners to produce
corners in the silicon that  are  closer  to  the  ideal  layout.
Determining  the  optimal  type,  size,  and  symmetry  (or  lack
thereof) is very complex and depends  on  neighboring  geometries
and  process  parameters.  A  sophisticated  computer  program is
necessary to properly implement OPC.

Proper OPC provides for an enhanced process window for both dense
and  isolated  lines.  It  provides wider process latitude for an
existing process or creates a process window for a  new,  smaller
feature   process.   OPC   enables  significant  savings  through
extending the lifetime of existing  lithography  equipment.   OPC
offers   basic   corrections   and   a  useful  amount  of  yield
improvement.

For additional information, access: OPC

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