MICROELECTRONIC SYSTEMS NEWS

FILENUMBER: 1162 BEGIN_KEYWORDS High-Density Embedded Memory END_KEYWORDS DATE: May 2004 TITLE: Implementing High-Density Embedded Memory
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TITLE: Implementing High-Density Embedded Memory

In today's system-on-chip designs,  the  incorporation  of  high-
density  embedded  memory  is  often  essential  since  it  often
comprises 50% of the  IC's  area.  The  International  Technology
Roadmap for Semiconductors predicts this will grow to over 90% by
2011 and thus will have a dominant impact  on  chip  cost,  area,
power  and  yield.  Monolithic System Technology (MoSys) offers a
one-transistor synchronous random  access  memory  (1T-SRAM)  for
embedded  applications  and  was recently acquired by Synopsys to
add to its DesignWare  portfolio.   The  1T-SRAM  is  actually  a
dynamic  bit  cell  with  one  transistor  and  capacitor with no
connections across  the  power  rails.   Thus,  for  90-nanometer
designs,  the  leakage  of  these  1T-SRAM memories in 'retentive
standby mode' is only one-fourth  that  of  comparably  sized  6T
memories.   MoSys'  licensees  have  shipped more than 50 million
chips incorporating this technology.

For additional information, access: MoSys

NOTE: MoSys files suit to force Synopsys merger
	  EE Times (April 23, 2004 issue)

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