MICROELECTRONIC SYSTEMS NEWS
FILENUMBER: 1309
BEGIN_KEYWORDS
3D-IC PROCESS
END_KEYWORDS
DATE: June 2010
TITLE: 3D-IC PROCESS AVAILABLE VIA CMP/CMC/MOSIS
================================================================= TITLE: 3D-IC PROCESS AVAILABLE VIA CMP/CMC/MOSIS CMP/CMC/MOSIS are partnering to offer a 3D-IC Multi-Project Wafer service based on Tezzaron's SuperContact technology and GLOBAL FOUNDRIES 130-nm CMOS process. The first MPW run is targeting January 2011. For additional information, click here. =================================================================
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