MICROELECTRONIC SYSTEMS NEWS
FILENUMBER: 524
BEGIN_KEYWORDS
Text Low-Power Microelectronics Machado
END_KEYWORDS
DATE: september 1996
TITLE: Text on Low-Power Microelectronics by Machado
Text on Low-Power Microelectronics
(Contributed by Gerson Machado of Imperial College)
"Low-Power HF Microelectronics: A Unified Approach" is a thorough
and integrated treatment of the key topics currently emerging in
low-voltage, low-power, mixed-mode design for the manufacture of
low cost but high performance, robust ICs. It brings together in-
novative modelling, simulation and design techniques in CMOS,
SOI, GaAs and BJT, optimally combining process, device and design
knowledge of low-voltage, HF systems, including smart sensors.
The book meets the needs of mixed-signal designers and reflects
the rise of ultra-low-power digital systems combined with wire-
less telecommunications. The text is supported throughout by
realistic application examples and a wealth of references (in-
cluding many Internet resources).
"It is the merit of this book to assemble an impressive collec-
tion of up-to-date and original tutorial contributions from industry
and university specialists spanning the whole hierarchy of
microelectronics" from the Foreword by Prof Eric A Vittoz, CSEM.
Contents: Foreword E Vittoz; 1: Introduction - Low-power HF mi-
croelectronics: a unified approach G Machado (56 pp.); Part 1:
Process technology; 2: Device structures and device simulation
techniques S Selberherr et al. (27 pp.); 3: Stanford's ULP CMOS
technology & applications J Burr et al. (54 pp.); 4: SOI tech-
nology JP Colinge (46 pp.); 5: Radiation effects on ICs and a
mixed analog CMOS-NPN-PJFET-on-insulator technology O Flament, JL
Leray et al. (26 pp.); Part II: Device
modelling/characterisation and circuit simulation; 6: Modelling
and characterisation of GaAs devices A Parker & J Scott (36 pp.);
7: The EKV model: a MOST model dedicated to low-current and low-
voltage analogue circuit design and simulation C Enz (54 pp.);
8: Non-linear dynamic modelling of RF bipolar transistors V Porra
et al. (31 pp.); 9: APLAC: object- oriented circuit simulator
and design tool M. Valtonen et al. (40 pp.); 10: Noise coupling
in mixed-signal ASICs T Schmerbeck (58 pp.); Part III: Reliabil-
ity and test; 11: Robust design and reliability analysis A Brom-
bacher (22 pp.); 12: Dynamic reliability of systems M Soma (21
pp.); 13: Fault modelling and simulation for the test of in-
tegrated analog and mixed-signal circuits M Ohletz (36 pp.);
Part IV: Circuit and system design methodology; 14: High-speed
and low-power techniques in CMOS and BiCMOS C Svensson (23 pp.);
15: Ultra-low-power digital design C Piguet (47 pp.); 16: Matched
delay technique for high speed digital design W Liu et al. (26
pp.); 17: Statistical design and optimisation for high- yield
BiCMOS analog circuits T To, M Ismail et al (47 pp.); 18: Design
considerations for high-speed amplifiers using complementary BJTs
A Payne & C Toumazou (31 pp.); 19: S2I techniques for analog
sampled-data signal processing G Machado et al. (55 pp.); 20:
Design of wireless portable systems B Baringer, R Brodersen et
al. (20 pp.); 21: Low-power RF ICs and system architectures for
portable communications A Abidi (52 pp.); 22: Analog and digital
CMOS design for spread spectrum wireless communications S Sheng,
R Brodersen et al. (20 pp.); 23: Design considerations for BJT
active mixers B Gilbert (92 pp.); 24: Distortion in short chan-
nel FET circuits D Webster D Haigh et al. (30 pp.); 25: Intelli-
gent sensor systems and smart sensors: concepts, focus points and
technology G Meijer et al. (18 pp.); 26: Intelligent sensor sys-
tems and smart sensors: applications G Meijer et al. (42 pp.);
Index.
To place your order please contact:
IEEE Service Center, IEE/INSPEC Department 445 Hoes Lane, Pisca-
taway, NJ 08855-1331 Phone 908-562-5553 Fax 908-562-87-37 email
inspec@ieee.org
OR
The Institution of Electrical Engineers,
P.O. Box 96, Stevenage, Herts. SG1 2SD, UK Tel. +44 (0)1438 313
311 Fax +44 (0)1438 742 792 email books@iee.org.uk
dbouldin@utk.edu
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