MICROELECTRONIC SYSTEMS NEWS



FILENUMBER: 6013
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Wafer-Scale Conference Proceedings
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DATE: april 1994
TITLE: Wafer-Scale Conference Proceedings Available

Wafer-Scale Conference Proceedings Available

 The IEEE Int'l Conference on Wafer-Scale Integration, held in January 1994,
covered both hybrid wafer-scale (also known as Multi-Chip Modules) and
conventional WSI.  Sponsored by two of the IEEE's Societies, it
consisted of 37 papers in the following sessions:
  -- Applications       (A & B -- 9 papers)
  -- Yield Assessment   (5 papers)
  -- Reconfiguration    (A & B -- 9 papers)
  -- Testability        (5 papers)
  -- Physical Issues    (A & B -- 8 papers)
  -- Keynote: WSI Evolution

  There were about 100 copies of the softcover Proceedings, in a convenient
6"x9" textbook size, left over after the Conference; they are available
at $35 each (about $1 per paper!), and the price includes surface
shipment worldwide (add $10 for international air shipment).  To
order, send a check, made out to "IEEE WSI Conference", to:

   Paul Wesling              p.wesling@ieee.org
   12250 Saraglen Drive
   Saratoga, CA  95070  USA

  For a copy of the Call for Papers for the 1995 WSI Conference, send
an email request to Program Chair Prof. Glenn Chapman at
glennc@cs.sfu.ca

Also covered in the Proceedings: 3D-WASP program; Pixel/image
processing appplications; CAD tool for MCM package design; local
sparing, reconfiguration, and redundancy; integrated testability,
diagnosis, and DFT issues; clock-sync and communication speed; FERMI
projects for high-energy physics; New applications: ATM, magnetic
sensors, DSP.

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