MICROELECTRONIC SYSTEMS NEWS
FILENUMBER: 9833
BEGIN_KEYWORDS
TEXT CMOS DESIGN
END_KEYWORDS
DATE: August 1998
TITLE: NEW TEXT ON CMOS CIRCUIT DESIGN, LAYOUT AND SIMULATION
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TITLE: NEW TEXT ON CMOS CIRCUIT DESIGN, LAYOUT AND SIMULATION
Authors: Dr. R. Jacob Baker, Dr. Harry W. Li, Dr. David Boyce
Univ. of Idaho
IEEE Press: 1-800-678-4333 or customer.service@ieee.org
ISBN 0-7803-3416-7 (902 pages) copyright 1998.
The book can also be purchased online from Amazon, Barnes and Noble,
Borders, or Computer Literacy.
The authors maintain a website that contains the full version of the PC
layout software (called LASI, for both DOS and Windows), a cell library,
SPICE input files that correspond to the book examples, and other useful
information.
The address is: BOOK
------------ Update:
Date: 23 August 2002
From: JBaker@boisestate.edu
Subject: [MOSIS_Users_Group] WinLASI information
To: MOSIS_Users_Group@yahoogroups.com
Cc: Lasicad@aol.com
Hi All,
I am not aware of a DRC deck specifically written for TSMC's
0.35um process. I would suggest downloading the Wmosis.zip file
located at: WinLASI
The files ending in *.drc in the mosis.zip file were written for
standard, deep and submicron MOSIS design rules. You can modify
one of these files for the TSMC process (or just use the MOSIS
design rules directly). I haven't had any problems with the
design rule checking in LASI. It is very powerful and you can do
a lot with it (which is a double edged sword...more power but
also more skill needed to write the check files). The only
problem I've had is related to electrical rule checking, ERCs,
(students not tying down the n-well with n+).
I would love to see a LASI user's group. I've made an attempt to
solicit contributions (cells, DRC decks, etc.) located at:
LASI Contributions
Perhaps, unless there is significant interest in a WinLASI user's
group, we can continue to use the MOSIS user's group (unless the
volume of contributions increases becoming a nuisance to the
MOSIS user's that don't use LASI). Also, I'm always willing to
post contributions on the above link.
Take care and thanks for the interest, Jake (jbaker@ieee.org).
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dbouldin@utk.edu