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TITLE: MEMSCAP MEMS FOUNDRY FOR AMS AVAILABLE VIA CMP
Grenoble, France - June 2000 - CMP and MEMSCAP S.A. announce the
introduction of a MEMS Foundry Module for the 0.8-micron CMOS
DLP/DLM compatible front side bulk micromachining technology from
AMS, Austria.
Started in 1995, the micromachining program of CMP allows
Universities, R&D Laboratories and Industry to have easy access
to MEMS technologies. Microelectronics-compatible bulk
micromachining (in CMOS, BiCMOS and HEMT GaAs) as well as MEMS-
specific processes have been provided.
The engineering kit enables front side bulk micromachining
process based on the 0.8-micron CMOS DLP/DLM technology from AMS.
The Foundry Module offers customization for MEMSCAP design tool
suites available for Mentor Graphics and Cadence flows. MEMSCAP
software is distributed by CMP.
This Foundry Module offers the following features:
- Technology files and design rule checker, checking the specific MEMS design
rules
- 3-D viewer
- Layout to and from 3D Solid Model Generator (link to ANSYS)
- Anisotropic etching simuation
- MEMS Behavioral models library (HDL-A, VHDL-AMS)
Starting from this Foundry Module, CMP proposes a complete
service at a very low cost to develop MEMS devices, including
design support, verification, manufacturing, TMAH wet etching
post process and packaging.
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About CMP--CMP is a broker for a number of technologies
(prototyping and low volume production). Since 1981, 400
university centers and 130 industrial companies from 60 countries
have been served, more than 3000 integrated circuits have been
fabricated and 20 semiconductor houses have been interfaced.
- Integrated circuits
AMS:
0.8u CMOS DLP/DLM
0.6u CMOS DLP/TLM
0.3u CMOS DLP/TLM (4LM)
0.8u BiCMOS DLP/DLM
0.8u SiGe HBT-CMOS DLP/DLM
STMicroelectronics:
0.18u, 0.25u 6LM
Peregrine Semiconductor:
.5u SOI/SOS CMOS DLP/TLM
PML:
0.2u HEMT GaAs HEMT
- MEMS:
. CMOS and GaAs compatible bulk micromachining
. MUMPs from CRONOS (Europe, Africa, South America,...)
- Design kits
more than 35 design kits
- MCM and 3D packaging
L, C, D, 3D
- CAD software
CADENCE, MEMSCAP, TANNER, ARM,...
- Packaging
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About MEMSCAP--MEMSCAP is the leading provider of commercial
design technology and services for development of MEMS-based
wireless, fiber optic and consumer electronics systems. MEMSCAP
offers concept-to-foundry MEMS design platforms for PC and UNIX,
foundry libraries, model generation tools and component designs
that help engineering teams get MEMS-based products to market
quickly. Additionally, the company offers professional design
services for customers seeking to accelerate or jumpstart product
development.
MEMSCAP customers include 3M, Robert Bosch, Canadian
Microelectronics Corporation, Cleveland Clinic Foundation,
Cronos/MCNC, Eastman Kodak, Ford Motor Company, Fujitsu
Laboratories, Lucent Technologies, NASA, Schlumberger, Microsoft,
Motorola,National Instruments, Procter & Gamble, Rockwell,
Sensonor, University of Tokyo andXerox Corporation. European
headquarters are located in Grenoble, France. North American
headquarters are in Raleigh, North Carolina. MEMSCAP also has a
growing operations center in Berlin, Germany. Sales offices and
distributors are located around the world. More information on
the company's products and services can be obtained at Memscap
Circuits Multi-Projets
46 avenue Felix Viallet
38031 Grenoble Cedex - FRANCE
Tel.: +33 4 76 57 48 04
Fax: +33 4 76 47 38 14
E.mail: cmp@imag.fr
WWW
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FILENUMBER: 9932
BEGIN_KEYWORDS
MEMSCAP MEMS AMS CMP
END_KEYWORDS
DATE: July 2000
TITLE: MEMSCAP MEMS FOUNDRY FOR AMS AVAILABLE VIA CMP
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