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TITLE: MEMS FOUNDRY SERVICE AVAILABLE VIA CMP
Circuits Multi-Projects (CMP) and MEMSCAP S.A. have introduced a
MEMS Foundry Module for the 0.8-micron CMOS DLP/DLM compatible
front side bulk micromachining technology from AMS, Austria.
Started in 1995, the micromachining program of CMP allows
universities, research laboratories and industry to have easy
access to MEMS technologies. Microelectronics-compatible
bulk micromachining (in CMOS, BiCMOS and HEMT GaAs) as well as
MEMS- specific processes have been provided. CMP now supports
a complete service at a very low cost to develop MEMS
devices, including design support, verification, manufacturing,
TMAH wet etching post process and packaging. CMP is a
broker for a number of technologies (prototyping and low
volume production). Since 1981, 400 university centers and
130 industrial companies from 60 countries have been served, more
than 3000 integrated circuits have been fabricated and 20
semiconductor houses have been interfaced.
For additional information, access:
CMP WWW or MEMSCAP WWW.
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FILENUMBER: 9940
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MEMSCAP CMP
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DATE: December 2000
TITLE: MEMS FOUNDRY SERVICE AVAILABLE VIA CMP
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