http://www.us.design-reuse.com/news/news16333.html
STMicroelectronics and IBM to Collaborate on Chip Technology
Geneva, Switzerland and Armonk, N.Y. July 24, 2007:
STMicroelectronics (NYSE: STM) and IBM (NYSE: IBM) today announced
that the two companies have signed an agreement to collaborate on the
development of next-generation process technology - the "recipe" that
is used in semiconductor development and manufacturing.
The agreement includes 32-nanometer (nm) and 22nm CMOS process-technology development,
design enablement and advanced research adapted to the manufacturing
of 300-millimeter (mm) silicon wafers. In addition it includes both
the core bulk CMOS technology and value-added derivative
System-on-Chip (SoC) technologies and positions both companies at the
leading edge of technology development. The new agreement between IBM
and ST will also include collaboration on IP development and platforms
to speed the design of system-on-chip devices in these technologies.
As part of the agreement, each company will establish a technical
development team at the other company's facility. For bulk CMOS
development, ST will establish a research and development team in
IBM's Semiconductor Research and Development Center in East Fishkill
and Albany, New York. At the same time, IBM will establish a research
and development team at ST's 300mm wafer semiconductor R&D and
fabrication facility in Crolles, France, where the two companies will
jointly develop a variety of value-added derivative technologies, such
as embedded memory and analog/RF. These technologies can be broadly
applied in consumer and server markets and in wireless applications,
such as cell phones and global positioning devices.
STMicroelectronics will join a partnership of semiconductor
manufacturing, development and technology companies who collaborate to
address the design complexity and advanced process development
necessary for producing smaller, faster, more cost efficient
semiconductors. Members in this six-company development network -
known as the IBM CMOS technology alliance - benefit from early access
to technology, the ability to drive technology definition, the
combined research and development resources for problem solving and
access to a common manufacturing base.
Similarly, IBM and ST will work together to expand the network at ST's
300mm wafer semiconductor fabrication facility in France to include
other members of IBM's CMOS technology alliance interested in the
development of value-added derivative SoC technologies.
By participating in open ecosystems that share resources among its
members, companies in these technology alliances realize an increase
in the speed of innovation and decrease in associated costs that
result from pooling individual research and development strength and
intellectual property. As the alliances expand, the benefits from the
collaborative relationships increase exponentially as more associates
apply more resources to the challenge of designing and manufacturing
better semiconductors, faster and cheaper.
ST has made the strategic decision to focus more of its research and
development resources on developing value-added derivatives that
capitalize on our extensive know-how in system-orientated
technologies, said Laurent Bosson, executive vice-president,
Front-end Technology and Manufacturing, STMicroelectronics. Given
IBM's distinguished track record in the development of advanced
semiconductor technologies, we believe working with them will give
both companies the right level of expertise and technical solutions to
address and conquer these strategic challenges and ensure time to
market of competitive products.
The addition of STMicroelectronics to the IBM technology alliance
continues to strengthen our ability to address the semiconductor
industry's technical and economic challenges inherent in developing
advanced technologies, said John E. Kelly III, senior vice president,
IBM Research. Our joint expertise and cooperative efforts with ST
will help enhance process development efforts while also delivering
faster time to market and greater technology advantage to our
clients.
The jointly developed processes will be ramped up into volume
production at ST's 300mm wafer semiconductor fabrication facility
(Crolles, France), as well as in the Common Platform manufacturers
300mm facilities, which includes IBM.
With a longer-term perspective, IBM, CEA-LETI (Grenoble, France), and
ST plan to work on advanced topics for future technology nodes,
building on the long history of successful collaboration between the
CEA-LETI public research institute and ST.
Financial details relating to this deal were not disclosed.
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering
semiconductor solutions across the spectrum of microelectronics
applications. An unrivalled combination of silicon and system
expertise, manufacturing strength, Intellectual Property (IP)
portfolio and strategic partners positions the Company at the
forefront of System-on-Chip (SoC) technology and its products play a
key role in enabling today's convergence markets. The Company's shares
are traded on the New York Stock Exchange, on Euronext Paris and on
the Milan Stock Exchange. In 2006, the Company's net revenues were
$9.85 billion and net earnings were $782 million. Further information
on ST can be found at www.st.com.
About IBM Microelectronics
For further information about IBM Microelectronics, visit
http://www.ibm.com/chips/
For more information about IBM Research, visit http://www.ibm.com/research